MS-3000X

The MS-3000X provides the highest precision and contrast images suitable for high speed 3D-X-ray inspection with the minimum oblique angle, compared to the so called oblique CT or CT scanning technologies which have higher noise and lower contrast by scattering of radiation.
The system offers precise solder joint inspection at the Solder Joint level, with fast throughput .
The MS-3000X offers real solder joint integrity inspection with high-speed, the highest contrast, and clearest images on the market.
The system design incorporates a granite base to provide vibration damping  resulting in very high accuracy.   High speed linear motors position the board to capture the very stable images.