BF-SPIder

Solder Paste Inspection

As pad sizes diminish and BGA/CSP packaging become more commonplace, the requirement for accurate printing is becoming critical. By measuring the volume of solder paste in real-time, the Solder Paste Inspection (SPI) system can feed-back any defects to the printing process, thereby eliminating potential defects that could arise in the re-flow process. Defects such as anomalies hidden under the paste, which could not be detected with 2 dimensional inspection systems, can now be detected.

The newly developed Phase Measurement Profilometer Technology ensures high inspection repeatability. Advanced analysis capability is achieved by integrating the original state-of-the-art Saki 3D measurement technology. The 2D inspection measures solder deposition area and the base reference point for a precise height, while the 3D inspection system provides the height and volume measurement. The system accurately detects multi-color PCBs, resists and silk prints with two types of LEDs.