2D AOI Technology

[Line Scanning Technology]

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Line Scanning Technology is Saki’s original high speed imaging technology which captures an image of entire substrate in one scanning operation just as copying machine. This imaging method is capable of obtaining multiple images from different lighting angles by lighting multiple lights respectively in one scanning operation. Our newly developed optical system realizes high resolutions and higher S/N ratio, which results in further speed improvement by 55%. It has made it possible to complete image processing for 330 x 250mm size substrate within 4 seconds and 500 x 460mm size substrate within 7 seconds. Our high speed processing technology can afford to deal with any super-high speed production line in the industry. Despite high speed capability, our machine structure is simple and compact. Acceleration with operating parts is small and the structure is simple with one axis. Therefore, our machines have long life of service and there are many machines that have been operating in line for more than 10 years.


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[Full Memory to capture an entire substrate image]

With our full memory technology, machines can capture all parts on substrate in one view from large connectors to microchips such as 0402 and 0603, which allows easier operation with intuitive judgment. An entire substrate image without joints makes it easier to create inspection data from large components to microchips in a unified procedure. The same approach is introduced to our 3D-AOI and 3D-AXI so that inspection should be performed without depending on FOV size.


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[Co-axial Overhead Lighting for Image with No Directivity]

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Co-axial overhead lighting technology is Saki’s original development, which can create an image for every field of view with overhead lighting. Coaxial Top light achieves non-shadowed inspection on the component next to taller objects. It is especially helpful to inspect high density substrate as well as microchips located between connectors. Co-axial overhead lighting is also effective for solder fillet inspection based on relations between tilt angle and brightness. Without overhead lighting, parts next to taller components fall in a shadow caused by conventional lighting. In case of co-axial overhead lighting, same inspection data can be shared among same inspection components, which helps to facilitate inspection data management and contribute to a speedy start-up of production.


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[Saki’s Original Large Diameter Telecentric Lens System]

When combined with line scanning technology, it can capture a sharp image from overhead through telecentric lens.


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[Digital Shading Compensation]

Digital shading compensation refers to our original technique to correct luminance and avoid uneven brightness and aberration within pixel in real time during scanning. Combining with multiple lightings, our machines are designed to correct and eliminate uneven brightness and image distortion theoretically to none within a broad view of 1500 mega pixels. Therefore, superior repetition reproducibility and good compatibility between machines are highly assured.


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[Double-side Inspection]

With advantages of line scanning technology such as one axis simple structure and low vibration, our machines are capable of scanning both sides of inspection substrate from top and bottom simultaneously. This can effectively serve especially at final confirmation process after selective soldering for deformed components. Our machines’ compact body and safety design support easier installation into cell production line.


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[Whole Surface Inspection]

Line scanning technology captures an image for entire substrate whether parts are placed or not. Taking advantage of this approach, our machines can detect any drop of part or foreign material by comparing entire substrate image with reference board. Approximately 10 substrates should be scanned firstly in order to automatically generate reference board image data. While generating reference board image, machines will study variation in multi-variable system based on pixel. By computing and comparing inspection substrate and reference substrate, machines will detect excessive material, foreign material, solder ball and damage on substrate surface. Reference board image can be updated as necessary in order to deal with change of electrical part and substrate material.


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