Automated inspection of electronic assemblies helps manufacturers assure their customers of the best possible quality; that only units passing strict criteria are allowed to leave the factory, and any that do not, can be identified and prevented from escaping. It is challenging for AOI inspection to assure the quality of hidden parts of the assembly, and only X-ray inspection can “see inside” solder joints to detect voids or check inadequate solder wetting beneath components.

 

Download our free AXI Whitepaper to discover how to:

 

  • Achieve high precision image quality even for the most hidden parts;
  • Detect the most difficult to find defects;
  • Optimize tact-time;
  • Reduce programming complexity;
  • Minimize human interventions
  • Reduce maintenance costs.

 

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