Press

2021/04/07

Cutting edge inspection technologies that contribute to improving production efficiency and enhancing production quality across the entire assembly line

Tokyo, Japan – April 7, 2021 – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting its latest 3D Solder Paste Inspection (SPI) and 3D Automatic Optical Inspection (AOI) systems on two booths at NEPCON China 2021. Visitors to the event are invited to interact with Saki equipment on the FUJI CORPORATION (FUJI) booth #1G60 and on the Shanghai Cent-Sun Electronic Co., Ltd. (CSE) Booth #1J25 where Saki will introduce its new innovative Z-axis optical-head control feature. The thirtieth NEPCON China exhibition will run from April 21 – 23 at the Shanghai World Expo Exhibition and Convention Center.

 

On booth #1J25, in collaboration with CSE, its China market distributor, Saki will show the large format 3Si-LD2 3D Solder Paste Inspection (SPI) system along with two models from its 3Di Series of AOI machines: the 3Di-LS2 and 3Di-LD2, which are the single-lane and dual-lane variants respectively of the company’s new large format 3D AOI machines. Saki’s 3Di Series AOI machines can all be fitted with the new Z-axis solution to achieve inspection of tall components, press-fit components and PCBAs in jigs. A maximum height-measurement range in 2D and 3D mode up to 40mm is made possible. Visitors to the CSE booth will experience a live demonstration of the newly developed Z-axis system.

 

The 3Di-LS2 and 3Di-LD2 platforms support board sizes up to 19.7 x 20.07 inches (500 x 510mm) and are available in three resolutions of 7μm, 12μm and 18μm. Saki L size AOI and SPI systems share many hardware and software characteristics designed to reduce running costs for customers.

 

On the FUJI booth #1G60, the compact Saki 3Di-MS2 AOI system will be featured in a special display area entitled ‘SiP and module board solutions’ within an SMT assembly line equipment configuration. As part of Saki’s 3Di Series, the 3Di-MS2 applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.

 

“We are excited to be exhibiting with our China distribution partner CSE and collaborating with FUJI in its dedicated System in Package and module board solutions area,” says Zheng Ri, General Manager of Saki China. “We look forward to exhibiting our solutions that are ideally suited to the types of sophisticated surface mount assembly applications of our customers in China. This will be the first time our Z-axis solution will be on display in China and we invite you to visit the booth for a personal demonstration. We look forward to meeting you at the show.”

 

For more information about Saki visit www.sakicorp.com/en/.

Saki to exhibit latest 3D-SPI and 3D-AOI System Solutions at NEPCON China 2021.

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