Inline 3D-CT Automated X-ray Inspection Systems


BF-X Series

BF-X2 for IGBTs

The system inspects a wide range of devices from multilayer PCBs, semiconductor component inspection including solder joints of flip chips, TSV, and voids in laser-through-holes, power modules, and insulated gate bipolar transistors (IGBT) devices requiring solder inspection using high energy x-ray.


Saki's unique "Planar CT" technology

Acquires high-quality CT images of planar objects using fewer projections

Identifies various defects in 3D images
Enables inspection without any interference from the opposite side of the board.

Head in Pillow

Through Hole

Intuitive User-friendly software

High accuracy true 3D automatic inspection

Displays actual measurement and target point with 3D images

Displays defects in high-precision 3D color images
The system displays 3D reconstruction, 3D inspection, and 3D image display for all captured images.

Fillet shape of good chip

Fillet shape of lifted chip

Expands the range of inspection

Inspection of standard PCBs, components and solder joints, and other electric components

Head in Pillow (HIP)
Detection and measurement of voids in multilayer PCB power modules.
Inspection of PCBs as well as semiconductors and power modules.

Click here for
the brochures download form
Products TOP Page