Feature
Saki's unique "Planar CT" technology
Acquires high-quality CT images of planar objects using fewer projections
Identifies various defects in 3D images
Enables inspection without any interference from the opposite side of the board.
Head in Pillow
Through Hole
Intuitive User-friendly software
High accuracy true 3D automatic inspection
Displays actual measurement and target point with 3D images
Displays defects in high-precision 3D color images
The system displays 3D reconstruction, 3D inspection, and 3D image display for all captured images.
Fillet shape of good chip
Fillet shape of lifted chip
Expands the range of inspection
Inspection of standard PCBs, components and solder joints, and other electric components
Head in Pillow (HIP)
Detection and measurement of voids in multilayer PCB power modules.
Inspection of PCBs as well as semiconductors and power modules.
