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</html><description>See Saki&#x2019;s M2M communication in action at the Fuji booth 1317 and Hermes/CFX production line Fremont, CA &#x2013; 22 January 2019&nbsp;&#x2013;&nbsp;Saki Corporation, an innovator in the field of automated optical and x-ray inspection and measurement equipment, will present its 3D solder paste inspection (SPI), automated optical inspection (AOI), and automated x-ray inspection (AXI) systems, plus new 2D Bottom-side AOI, at IPC APEX Expo 2019, January 29-31, at the San Diego Convention Center, San Diego, CA, at booth #1407. In addition, Saki&#x2019;s M2M communication/Industry 4.0/Smart Factory capabilities will be on display in the Fuji booth&nbsp;#1317 and in the Hermes/CFX production line. Saki&#x2019;s 3Di Series is the fastest AOI system in the industry. It has scalable resolutions of 7&#xB5;m, 12&#xB5;m, and 18&#xB5;m,...</description><thumbnail_url>https://www.sakicorp.com/en/wp-content/uploads/sites/2/2025/09/og_saki_logo-768x432-1.png</thumbnail_url><thumbnail_width>768</thumbnail_width><thumbnail_height>432</thumbnail_height></oembed>
