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https://www.sakicorp.com/en/wp-content/uploads/sites/2/2025/08/Semicon_800×444.png800444SAKI develops state-of-the-art automated optical and X-ray inspection systems for advanced semiconductor packaging processes.Our solutions accurately detect defects in microbumps, TSVs, TGVs, and other critical structures. We address the challenges of increasingly miniaturized and complex semiconductor device manufacturing, supporting high-reliability quality assurance in the era of AI, 5G, and electric mobility. Inspection Targets in Semiconductor Packaging 01 3D Microbump Inspection SAKI’s high-resolution 3µm SPI system delivers precise, automated inspection of finely printed microbumps. Despite being an automated visual inspection solution, it achieves measurement accuracy comparable to 3D metrology equipment. It also supports solder paste inspection for stencils with apertures of 50µm or less. 02 Die Surface Height Measurement SAKI’s advanced 3µm resolution AOI system measures die surface height with exceptional...