{"id":4227,"date":"2025-07-28T18:24:50","date_gmt":"2025-07-28T09:24:50","guid":{"rendered":"https:\/\/www.sakicorp.com\/en\/?page_id=4227"},"modified":"2025-10-09T10:18:17","modified_gmt":"2025-10-09T01:18:17","slug":"semicon","status":"publish","type":"page","link":"https:\/\/www.sakicorp.com\/en\/technology\/semicon\/","title":{"rendered":"Semiconductor Inspection Solutions"},"content":{"rendered":"\n<div class=\"wp-block-group alignwide mv-narrow is-layout-constrained wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-cover alignwide\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"646\" class=\"wp-block-cover__image-background wp-image-4266 size-large\" alt=\"\" src=\"https:\/\/www.sakicorp.com\/en\/wp-content\/uploads\/sites\/2\/2025\/08\/AdobeStock_1422881626-1024x646.jpeg\" style=\"object-position:50% 58%\" data-object-fit=\"cover\" data-object-position=\"50% 58%\" srcset=\"https:\/\/www.sakicorp.com\/en\/wp-content\/uploads\/sites\/2\/2025\/08\/AdobeStock_1422881626-1024x646.jpeg 1024w, https:\/\/www.sakicorp.com\/en\/wp-content\/uploads\/sites\/2\/2025\/08\/AdobeStock_1422881626-300x189.jpeg 300w, https:\/\/www.sakicorp.com\/en\/wp-content\/uploads\/sites\/2\/2025\/08\/AdobeStock_1422881626-768x485.jpeg 768w, https:\/\/www.sakicorp.com\/en\/wp-content\/uploads\/sites\/2\/2025\/08\/AdobeStock_1422881626-1536x970.jpeg 1536w, https:\/\/www.sakicorp.com\/en\/wp-content\/uploads\/sites\/2\/2025\/08\/AdobeStock_1422881626-2048x1293.jpeg 2048w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><span aria-hidden=\"true\" class=\"wp-block-cover__background has-background-dim-0 has-background-dim\" style=\"background-color:#195479\"><\/span><div class=\"wp-block-cover__inner-container is-layout-flow wp-block-cover-is-layout-flow\">\n<div class=\"wp-block-group mv-title wrapper is-vertical is-layout-flex wp-container-core-group-is-layout-fe9cc265 wp-block-group-is-layout-flex\">\n<p>TECHNOLOGY<\/p>\n\n\n\n<h1 class=\"wp-block-heading\">Semiconductor Inspection Solutions<\/h1>\n<\/div>\n<\/div><\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-group wrapper pc-only is-layout-constrained wp-block-group-is-layout-constrained\"><ul class=\"breadcrumbs wp-block-saki-breadcrumbs yoast-breadcrumbs\"><li><a href=\"https:\/\/www.sakicorp.com\/en\/\">Home<\/a><\/li>  <li><a href=\"https:\/\/www.sakicorp.com\/en\/technology\/\">Technology<\/a><\/li>  <li>Semiconductor Inspection Solutions<\/li><\/ul><\/div>\n\n\n\n<div class=\"wp-block-group alignfull wrapper is-layout-constrained wp-block-group-is-layout-constrained\">\n<p class=\"technology-text lead\">SAKI develops state-of-the-art automated optical and X-ray inspection systems for advanced semiconductor packaging processes.<br>Our solutions accurately detect defects in microbumps, TSVs, TGVs, and other critical structures. We address the challenges of increasingly miniaturized and complex semiconductor device manufacturing, supporting high-reliability quality assurance in the era of AI, 5G, and electric mobility.<\/p>\n\n\n\n<p class=\"has-text-align-center technology-text lead\"><strong>Inspection Targets in Semiconductor Packaging<\/strong><\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full\"><img decoding=\"async\" src=\"https:\/\/www.sakicorp.com\/wp-content\/uploads\/2025\/07\/semicon_pachage.png\" alt=\"\" class=\"wp-image-4288\"\/><\/figure>\n\n\n\n<section class=\"wp-block-group alignfull technology-section is-layout-constrained wp-block-group-is-layout-constrained\" id=\"01\">\n<header class=\"wp-block-group is-nowrap is-layout-flex wp-container-core-group-is-layout-6c531013 wp-block-group-is-layout-flex\">\n<p class=\"block-circle ozwald\">01<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>3D Microbump Inspection<\/strong><\/h2>\n<\/header>\n\n\n\n<div class=\"wp-block-group technology-section-container is-layout-constrained wp-block-group-is-layout-constrained\">\n<p class=\"technology-text\">SAKI&#8217;s high-resolution 3\u00b5m SPI system delivers precise, automated inspection of finely printed microbumps. Despite being an automated visual inspection solution, it achieves measurement accuracy comparable to 3D metrology equipment. It also supports solder paste inspection for stencils with apertures of 50\u00b5m or less.<\/p>\n<\/div>\n<\/section>\n\n\n\n<section class=\"wp-block-group alignfull technology-section is-layout-constrained wp-block-group-is-layout-constrained\">\n<header class=\"wp-block-group is-nowrap is-layout-flex wp-container-core-group-is-layout-6c531013 wp-block-group-is-layout-flex\">\n<p class=\"block-circle\">02<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Die Surface Height Measurement<\/strong><\/h2>\n<\/header>\n\n\n\n<div class=\"wp-block-group technology-section-container is-layout-constrained wp-block-group-is-layout-constrained\">\n<p class=\"technology-text\">SAKI&#8217;s advanced 3\u00b5m resolution AOI system measures die surface height with exceptional accuracy, enabling the detection of chips and foreign matter beneath mirror-like surfaces. Saki&#8217;s proprietary imaging technology ensures highly accurate height measurement even on highly reflective surfaces &#8211; traditionally challenging for optical inspection.<a id=\"_msocom_1\"><\/a><a id=\"_msocom_2\"><\/a><\/p>\n\n\n\n<p class=\"has-text-align-center\">Die Chip Detection Using 3\u202f\u00b5m AOI<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full\"><img decoding=\"async\" src=\"https:\/\/www.sakicorp.com\/wp-content\/uploads\/2025\/07\/semi_chip.png\" alt=\"\" class=\"wp-image-4289\"\/><\/figure>\n<\/div>\n<\/section>\n\n\n\n<section class=\"wp-block-group alignfull technology-section is-layout-constrained wp-block-group-is-layout-constrained\">\n<header class=\"wp-block-group is-nowrap is-layout-flex wp-container-core-group-is-layout-6c531013 wp-block-group-is-layout-flex\">\n<p class=\"block-circle\">03<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Simultaneous X-ray Inspection of Microbumps, C4 Bumps, and BGA Bumps<\/strong><\/h2>\n<\/header>\n\n\n\n<div class=\"wp-block-group technology-section-container is-layout-constrained wp-block-group-is-layout-constrained\">\n<p class=\"technology-text\"><strong>High-Resolution X-Ray Insprection<\/strong><\/p>\n\n\n\n<p class=\"technology-text\">SAKI&#8217;s high-resolution AXI solution provides automated X-ray inspection of internal solder joints in semiconductors. To inspect the microbumps between the semiconductor chip and the interposer, we have achieved high-resolution tomographic imaging and a large depth of field through the rigidity and precision of the stages that comprise the planar CT. Meticulous system calibration further guarantees stable and precise inspection results.<\/p>\n\n\n\n<p class=\"technology-text\"><strong><strong>\u201cOne Scan, Multi-Layer Inspection\u201d<\/strong><\/strong><\/p>\n\n\n\n<p class=\"technology-text\">A key feature of SAKI&#8217;s AXI system is its ability to accurately distinguish and inspect multiple solder layers in a single scan, even for complex multi-layer semiconductor package structures. Unlike conventional systems that require multiple passes, SAKI&#8217;s proprietary planar computed tomography (PCT) technology enables complete full-layer inspection and analysis of all solder joints within a chip with just one scan. This reduces inspection time and significantly minimizes X-ray exposure.<\/p>\n\n\n\n<p class=\"has-text-align-center technology-text\"><strong>Multilayer Package Inspection<\/strong><\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full is-resized\"><img decoding=\"async\" src=\"https:\/\/www.sakicorp.com\/wp-content\/uploads\/2025\/07\/semi_package_1000\u00d7800.png\" alt=\"\" class=\"wp-image-4291\" style=\"width:700px\"\/><\/figure>\n\n\n\n<p class=\"technology-text\">SAKI&#8217;s 3D CT inspection delivers exceptional high-resolution imaging for complex semiconductor packages. It excels in handling challenging insprections such as microbump (20\u00b5m) bridge insprection, C4 bump (70\u00b5m) and BGA bump (150\u00b5m) non-wetting and void insprection &#8211; ensuring thorough evaluation and analysis of internal structures.<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full\"><img decoding=\"async\" src=\"https:\/\/www.sakicorp.com\/wp-content\/uploads\/2025\/07\/semi_package_1000\u00d7300.png\" alt=\"\" class=\"wp-image-4292\"\/><\/figure>\n\n\n\n<p class=\"technology-text\"><strong><strong>High-Speed Inspection for In-Line Implementation<\/strong><\/strong><\/p>\n\n\n\n<p class=\"technology-text\">SAKI&#8217;s AXI solutions are optimized for in-line operation, meeting the cycle time demands of SMT production processes. Through propriatary advanced high-speed processing, SAKI&#8217;s AXI synchronizes image acquisition with data processing to achieve real-time 3D data capture and inspection. Saki is committed to evolving semiconductor inspection to meet future industry challenges.<\/p>\n\n\n\n<p class=\"technology-text\"><strong>Minimizing Radiation Exposure Risk<\/strong><\/p>\n\n\n\n<p class=\"technology-text\">To support both product quality and operator safety, SAKI&#8217;s AXI systems are equipped with a radiation dose simulator. This allows for predictive dose control and adaptive imaging optimization. Additionally, X-rays are emitted only during image capture, further reducing overall radiation exposure.<\/p>\n\n\n\n<p class=\"has-text-align-center technology-text\"><strong>X-ray Dosage Simulator<\/strong><\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full\"><img decoding=\"async\" src=\"https:\/\/www.sakicorp.com\/wp-content\/uploads\/2023\/10\/X-raydosagesimulator.png\" alt=\"\" class=\"wp-image-1479\"\/><\/figure>\n\n\n\n<p class=\"technology-text\"><a href=\"https:\/\/www.sakicorp.com\/en\/technology\/xray\/\">SAKI&#8217;s X-ray Inspection Technology\u3000\uff1e<\/a><br><a href=\"https:\/\/www.sakicorp.com\/en\/product\/igbt-power-module-axi\/\">SAKI&#8217;s 3D X-ray Inspection Machine for IGBT Power Modules\u3000\uff1e<\/a><\/p>\n<\/div>\n<\/section>\n\n\n\n<div class=\"wp-block-group block-shadow-inset technology-summary is-layout-constrained wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-group is-layout-constrained wp-container-core-group-is-layout-f90d3be4 wp-block-group-is-layout-constrained\" style=\"padding-top:var(--wp--preset--spacing--40);padding-right:var(--wp--preset--spacing--30);padding-bottom:var(--wp--preset--spacing--40);padding-left:var(--wp--preset--spacing--30)\">\n<h2 class=\"wp-block-heading\"><strong>SAKI remains committed to driving innovation in semiconductor inspection. Looking ahead, we will expand our portfolio to include wafer-level inspection solutions, reinforcing our commitment to end-to-end quality assurance throughout the semiconductor manufacturing process.<\/strong><\/h2>\n<\/div>\n<\/div>\n<\/div>\n\n\n\n<section class=\"wp-block-group is-layout-constrained wp-block-group-is-layout-constrained\">\n<h2 class=\"wp-block-heading h-normal\">Related Solutions<\/h2>\n\n\n\n<div class=\"wp-block-group product-list wrapper is-nowrap is-layout-flex wp-container-core-group-is-layout-6c531013 wp-block-group-is-layout-flex\">\n<div class=\"wp-block-group block-shadow block-link is-vertical is-content-justification-center is-layout-flex wp-container-core-group-is-layout-ce155fab wp-block-group-is-layout-flex\">\n<h3 class=\"wp-block-heading\">3D-SPI<\/h3>\n\n\n\n<p class=\"has-text-align-center\">3D Solder Paste <br>Inspection Machine<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"588\" height=\"604\" src=\"https:\/\/www.sakicorp.com\/en\/wp-content\/uploads\/sites\/2\/2025\/09\/product_3D-SPI.jpg\" alt=\"\" class=\"wp-image-4319\" srcset=\"https:\/\/www.sakicorp.com\/en\/wp-content\/uploads\/sites\/2\/2025\/09\/product_3D-SPI.jpg 588w, https:\/\/www.sakicorp.com\/en\/wp-content\/uploads\/sites\/2\/2025\/09\/product_3D-SPI-292x300.jpg 292w\" sizes=\"auto, (max-width: 588px) 100vw, 588px\" \/><\/figure>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button block-link\"><a class=\"wp-block-button__link wp-element-button\" href=\"https:\/\/www.sakicorp.com\/en\/product\/3d-spi\/\">URL<\/a><\/div>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-group block-shadow block-link is-vertical is-content-justification-center is-layout-flex wp-container-core-group-is-layout-ce155fab wp-block-group-is-layout-flex\">\n<h3 class=\"wp-block-heading\">3D-AOI<\/h3>\n\n\n\n<p class=\"has-text-align-center\">3D Automated Optical Inspection Systems<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"588\" height=\"604\" src=\"https:\/\/www.sakicorp.com\/en\/wp-content\/uploads\/sites\/2\/2025\/09\/product_3D-SPI.jpg\" alt=\"\" class=\"wp-image-4319\" srcset=\"https:\/\/www.sakicorp.com\/en\/wp-content\/uploads\/sites\/2\/2025\/09\/product_3D-SPI.jpg 588w, https:\/\/www.sakicorp.com\/en\/wp-content\/uploads\/sites\/2\/2025\/09\/product_3D-SPI-292x300.jpg 292w\" sizes=\"auto, (max-width: 588px) 100vw, 588px\" \/><\/figure>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button block-link\"><a class=\"wp-block-button__link wp-element-button\" href=\"https:\/\/www.sakicorp.com\/en\/product\/3d-aoi\/\">URL<\/a><\/div>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-group block-shadow block-link is-vertical is-content-justification-center is-layout-flex wp-container-core-group-is-layout-ce155fab wp-block-group-is-layout-flex\">\n<h3 class=\"wp-block-heading\">3D-CT AXI\u200b<\/h3>\n\n\n\n<p>Inline 3D-CT Automated <br>X-ray Inspection Systems<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"588\" height=\"604\" src=\"https:\/\/www.sakicorp.com\/en\/wp-content\/uploads\/sites\/2\/2025\/09\/product_3D-CT-AXI.jpg\" alt=\"\" class=\"wp-image-4318\" srcset=\"https:\/\/www.sakicorp.com\/en\/wp-content\/uploads\/sites\/2\/2025\/09\/product_3D-CT-AXI.jpg 588w, https:\/\/www.sakicorp.com\/en\/wp-content\/uploads\/sites\/2\/2025\/09\/product_3D-CT-AXI-292x300.jpg 292w\" sizes=\"auto, (max-width: 588px) 100vw, 588px\" \/><\/figure>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button block-link\"><a class=\"wp-block-button__link wp-element-button\" href=\"https:\/\/www.sakicorp.com\/en\/product\/3d-ct-axi\/\">URL<\/a><\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n\n\n\n<div class=\"wp-block-group wrapper sp-only is-layout-constrained wp-block-group-is-layout-constrained\"><ul class=\"breadcrumbs wp-block-saki-breadcrumbs yoast-breadcrumbs\"><li><a href=\"https:\/\/www.sakicorp.com\/en\/\">Home<\/a><\/li>  <li><a href=\"https:\/\/www.sakicorp.com\/en\/technology\/\">Technology<\/a><\/li>  <li>Semiconductor Inspection Solutions<\/li><\/ul><\/div>\n\n\n\n<div class=\"wp-block-group product-detail-nav-container is-layout-constrained wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-group wrapper product-detail-nav block-shadow-inset is-layout-constrained wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-group is-nowrap is-layout-flex wp-container-core-group-is-layout-6c531013 wp-block-group-is-layout-flex\">\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button button\"><a class=\"wp-block-button__link wp-element-button\" href=\"https:\/\/www.sakicorp.com\/en\/catalog\/\">Download Brochure<\/a><\/div>\n\n\n\n<div class=\"wp-block-button button\"><a class=\"wp-block-button__link wp-element-button\" href=\"\/en\/contact\/\">Contact Us<\/a><\/div>\n\n\n\n<div class=\"wp-block-button button\"><a class=\"wp-block-button__link wp-element-button\" href=\"\/en\/contact\/product\/\">Request a Demo<\/a><\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n\n\n\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>SAKI develops state-of-the-art automated optical and X-ray inspection systems for advanced semiconductor packaging processes.Our solutions accurately detect defects in microbumps, TSVs, TGVs, and other critical structures. We address the challenges of increasingly miniaturized and complex semiconductor device manufacturing, supporting high-reliability quality assurance in the era of AI, 5G, and electric mobility. Inspection Targets in Semiconductor Packaging 01 3D Microbump Inspection SAKI&#8217;s high-resolution 3\u00b5m SPI system delivers precise, automated inspection of finely printed microbumps. Despite being an automated visual inspection solution, it achieves measurement accuracy comparable to 3D metrology equipment. It also supports solder paste inspection for stencils with apertures of 50\u00b5m or less. 02 Die Surface Height Measurement SAKI&#8217;s advanced 3\u00b5m resolution AOI system measures die surface height with exceptional&#8230;<\/p>\n","protected":false},"author":9,"featured_media":4256,"parent":1717,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-4227","page","type-page","status-publish","has-post-thumbnail","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/pages\/4227","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/users\/9"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/comments?post=4227"}],"version-history":[{"count":13,"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/pages\/4227\/revisions"}],"predecessor-version":[{"id":4430,"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/pages\/4227\/revisions\/4430"}],"up":[{"embeddable":true,"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/pages\/1717"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/media\/4256"}],"wp:attachment":[{"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/media?parent=4227"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}