{"id":4891,"date":"2026-10-15T10:25:22","date_gmt":"2026-10-15T01:25:22","guid":{"rendered":"https:\/\/www.sakicorp.com\/en\/?p=4891"},"modified":"2026-10-15T10:25:23","modified_gmt":"2026-10-15T01:25:23","slug":"saki-launches-new-inline-3d-bottom-side-aoi-system","status":"publish","type":"post","link":"https:\/\/www.sakicorp.com\/en\/news\/newsrelease\/4891\/","title":{"rendered":"SAKI Launches New Inline 3D Bottom-Side AOI System"},"content":{"rendered":"\n<div class=\"wp-block-group wrapper pc-only is-layout-constrained wp-block-group-is-layout-constrained\"><ul class=\"breadcrumbs wp-block-saki-breadcrumbs yoast-breadcrumbs\"><li><a href=\"https:\/\/www.sakicorp.com\/en\/\">Home<\/a><\/li>  <li><a href=\"https:\/\/www.sakicorp.com\/en\/category\/news\/\">Newsroom<\/a><\/li>  <li><a href=\"https:\/\/www.sakicorp.com\/en\/category\/news\/newsrelease\/\">News release<\/a><\/li>  <li>SAKI Launches New Inline 3D Bottom-Side AOI System<\/li><\/ul><\/div>\n\n\n\n<section class=\"wp-block-group is-layout-constrained wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-group is-layout-constrained wp-block-group-is-layout-constrained\">\n<header class=\"wp-block-group is-layout-constrained wp-block-group-is-layout-constrained\"><div id=\"post-date-category\">\n\t<div>\n\t\t\t\t\t<div>News release<\/div>\n\t\t\t<\/div>\n\t<time datetime=\"2026-10-15\">2026\/10\/15<\/time>\n<\/div>\n\n\n<h1 class=\"wp-block-post-title\">SAKI Launches New Inline 3D Bottom-Side AOI System<\/h1><\/header>\n\n\n\n<div class=\"wp-block-group is-layout-constrained wp-block-group-is-layout-constrained\">\n<p><strong>Advanced back-end inspection solution combines high-precision THT solder inspection with automated full-surface PCB inspection \u2013 without board flipping<\/strong><\/p>\n\n\n\n<p><strong>Tokyo, Japan \u2013 October 15, 2026 \u2013 SAKI Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce the launch of its new 3Di-LS3BX inline 3D bottom-side automated optical inspection (AOI) system. Designed to automate back-end PCB inspection following selective, wave, and dip soldering processes, the latest AOI system combines high-precision inspection of through-hole technology (THT) solder joints with simultaneous full-surface inspection, eliminating the need for PCB flipping and reducing manual handling requirements.<\/strong><\/p>\n\n\n\n<p>As quality assurance requirements become increasingly demanding, particularly in automotive electronics and other high-reliability applications, manufacturers face growing pressure to maintain consistent inspection quality while improving production efficiency. Conventional back-end inspection processes often require additional board handling or manual intervention, increasing operational complexity and the potential for handling-related damage.<\/p>\n\n\n\n<p>The 3Di-LS3BX machine addresses these challenges by enabling automated bottom-side inspection directly within the production line, supporting consistent inspection quality while reducing operator intervention and the risk of human error.<\/p>\n\n\n\n<p><strong>High-Precision 3D Inspection of THT Solder Joints<\/strong><\/p>\n\n\n\n<p>The 3Di-LS3BX combines dedicated THT solder inspection software, SAKI&#8217;s proprietary inspection algorithms, and precise 3D measurement to deliver stable and reliable inspection of component pins and solder fillets.<\/p>\n\n\n\n<p>SAKI&#8217;s proven high-rigidity gantry structure ensures stable inspection performance and excellent repeatability, while standard dome lighting supports consistent 3D imaging of sloped, reflective, and curved surfaces. Together, these technologies enable high-precision inspection while significantly reducing false calls.<\/p>\n\n\n\n<p><strong>Simultaneous Full-Surface Inspection with Full Memory Technology<\/strong><\/p>\n\n\n\n<p>In addition to standard component and solder fillet inspection, SAKI&#8217;s proprietary Full Memory Technology enables simultaneous inspection of solder balls and foreign object debris (FOD) across the entire PCB, including unexpected components.<\/p>\n\n\n\n<p>The system can detect solder balls down to 200 \u00b5m, providing an additional level of inspection coverage for potential defects that might otherwise remain undetected during conventional inspection processes.<\/p>\n\n\n\n<p><strong>Seamless Integration into Existing Inspection Environments<\/strong><\/p>\n\n\n\n<p>The 3Di-LS3BX uses the same software platform as SAKI&#8217;s solder paste inspection (SPI) and post-reflow AOI systems, providing a common operating environment and supporting standardized inspection workflows across SMT and back-end processes.<\/p>\n\n\n\n<p>An optional return conveyor can also be installed beneath the system to accommodate different production line configurations and simplify integration into existing manufacturing environments.<\/p>\n\n\n\n<p>With the introduction of the 3Di-LS3BX, SAKI further expands its inspection portfolio, providing manufacturers with integrated solutions that support consistent quality assurance throughout the production line, from SMT to back-end processes.<\/p>\n\n\n\n<p>For more information about the 3Di-LS3BX, please visit the SAKI <a href=\"https:\/\/www.sakicorp.com\/en\/product\/bottomside-3d-aoi\/\" target=\"_blank\" rel=\"noreferrer noopener\">product information page<\/a>.<\/p>\n\n\n\n<div class=\"wp-block-group is-vertical is-content-justification-center is-layout-flex wp-container-core-group-is-layout-b6f84900 wp-block-group-is-layout-flex\" style=\"margin-top:20px;margin-bottom:20px\">\n<figure class=\"wp-block-image size-full\"><img decoding=\"async\" src=\"https:\/\/www.sakicorp.com\/wp-content\/uploads\/2026\/10\/Return_Conveyor-scaled.jpg\" alt=\"\" class=\"wp-image-4815\"\/><\/figure>\n\n\n\n<p>3Di-LS3BX Image<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n\n\n<div id=\"post-navigation\">\n\t<div><a href=\"https:\/\/www.sakicorp.com\/en\/news\/newsrelease\/4825\/\" rel=\"prev\">Prev<\/a><\/div>\n\t<div><a href=\"https:\/\/www.sakicorp.com\/en\/news\/newsrelease\">News release List<\/a><\/div>\n\t<div><\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-group wrapper sp-only is-layout-constrained wp-block-group-is-layout-constrained\"><ul class=\"breadcrumbs wp-block-saki-breadcrumbs yoast-breadcrumbs\"><li><a href=\"https:\/\/www.sakicorp.com\/en\/\">Home<\/a><\/li>  <li><a href=\"https:\/\/www.sakicorp.com\/en\/category\/news\/\">Newsroom<\/a><\/li>  <li><a href=\"https:\/\/www.sakicorp.com\/en\/category\/news\/newsrelease\/\">News release<\/a><\/li>  <li>SAKI Launches New Inline 3D Bottom-Side AOI System<\/li><\/ul><\/div>\n\n\n\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Advanced back-end inspection solution combines high-precision THT solder inspection with automated full-surface PCB inspection \u2013 without board flipping Tokyo, Japan \u2013 October 15, 2026 \u2013 SAKI Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce the launch of its new 3Di-LS3BX inline 3D bottom-side automated optical inspection (AOI) system. Designed to automate back-end PCB inspection following selective, wave, and dip soldering processes, the latest AOI system combines high-precision inspection of through-hole technology (THT) solder joints with simultaneous full-surface inspection, eliminating the need for PCB flipping and reducing manual handling requirements. As quality assurance requirements become increasingly demanding, particularly in automotive electronics and other high-reliability applications, manufacturers face growing pressure to maintain consistent&#8230;<\/p>\n","protected":false},"author":9,"featured_media":4893,"comment_status":"open","ping_status":"open","sticky":true,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[9],"tags":[],"class_list":["post-4891","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-newsrelease"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/posts\/4891","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/users\/9"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/comments?post=4891"}],"version-history":[{"count":2,"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/posts\/4891\/revisions"}],"predecessor-version":[{"id":4936,"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/posts\/4891\/revisions\/4936"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/media\/4893"}],"wp:attachment":[{"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/media?parent=4891"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/categories?post=4891"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.sakicorp.com\/en\/wp-json\/wp\/v2\/tags?post=4891"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}