SAKI to Highlight Advanced Inspection Innovation at 40th NEPCON JAPAN

SAKI Corporation will be exhibiting at the 39th NEPCON JAPAN at the Tokyo Big Site Exhibition Center from January 21 to 23. We will showcase our latest automated inspection solutions covering everything from SMT to post-processes and semiconductor mounting. Our newly developed bottom-side 3D Automated Optical Inspection (AOI) system, designed to meet the growing demand for post-process automation, will be on display for the first time at Japanese exhibition

Exhibition Overview

• SMT area
  3D Solder Paste Inspection Systems（SPI）
  3D Automated Optical Inspection Systems（AOI）
  Inline 3D-CT Automated X-ray Inspection Systems（AXI）
  
• Post-processes aea
  bottom-side 3D Automated Optical Inspection Systems（AOI）※Latest product
  
• Semiconductor area
  High-resolution 3D Automated Optical Inspection Systems（AOI）※Exhibit panel
  High-resolution 3D-CT Automated X-ray Inspection Systems  ※Exhibit panel

Furthermore, we plan to introduce the latest software solutions such as AI solutions and QD Analyzer.

Booth image　※The actual booth layout may differ