Inline 3D X-ray Inspection Machine for IGBT Power Modules

Power
Module AXI

A 3D-CT X-ray inspection system that is ideal for IGBT power module inspection, the 3D-AXI achieves the industry’s fastest speed inspection while reliably detecting difficult defects such as voids in 3-layer soldering.

Providing exceptional serviceability and ease of maintenance, the 3D-AXI is a premier product for X-ray inspection.

X-Ray CT Inspection Specialized in Detecting Voids in Solder Joint Layers

Three-Layer Soldering Package

01

High Void-Detection Ability with 3D-CT X-Ray Inspection

  • Accurately detects thin voids that are historically problematic for inspection
  • Image noise removal is achieved by separating the solder layer and heat dissipation fins

In 2D inspection of IGBT power modules, where X-rays are applied from directly above, overlap between the solder layer and heat dissipation fin mean it is impossible to measure voids.

With Saki’s unique Planar CT technology, which specializes in imaging flat objects, each solder layer is separated to accurately detect voids.

Saki’s high-precision hardware design is essential for the creation of high-definition 3D data. The ultra-rigid gantry and high-resolution linear scale provide incredible accuracy in positioning for stable imaging.

Gantry position information is reflected in real-time calculations to obtain high-definition 3D images with clear edges.

Heat sink shadows are removed

Saki’s unique image processing technology separates the solder layer from radiation fins and removes the shadow of the radiation fins to erradicate image noise and more accurately detect voids that occur in the solder layer.

  Before Noise Cancelation (left) After Noise Cancelation (right) 

Highly accurate void inspection

Pass / fail judgments are made by measuring the void area of the solder layer. The noise cancellation filter of the new void inspection algorithm accurately detects thin voids that have been historically problematic for inspection.

Prior to application of the noise cancellation filter, artifacts other than the central void are also detected (left image). After filter application, the shape of the defect is detected more accurately (right image).

Before Noise Cancelation (left) After Noise Cancelation (right)

(green areas are recognized as defective)

Debug without stopping the production line

The offline debugging function enables the collection and debugging of images without stopping the operating equipment. Alongside real-time library updates, a catalogue of historic defect data is saved and can be re-inspected, significantly contributing to overall quality assurance.

02

Industry’s Fastest Inspection Speed

  • High-speed inspection achieved through multiple concurrent wide-area imaging processes
  • Optimized calculation processing means imaging and calculation processing are completed almost simultaneously

Imaging time reduced with expanded detector field of view

The new large detector reduces the number of FOV images through wide-area imaging, significantly cutting imaging time to offer the industry’s fastest speed for IGBT power module inspection.

Reducing the cycle time by transporting large jigs

An improved conveyor design allows for the loading of larger carriers, now up to 460mm x 600mm. Through batch imaging and inspection of multiple samples, cycle time is decreased, preparation time is shortened, and operator workload reduced, especially during tray setting.

Imaging process optimization with unique CT calculation technology

Saki’s combined hardware and software development ensures optimal image processing, with CT calculations presenting almost zero delay to the inspection process.

03

Ease of Maintenance

  • Long-life hardware design
  • Self-diagnostic function, X-ray dosage simulator and reduction

Long-life hardware design

High-precision, accurate, and stable inspections in a mass production environment require quality, durable hardware.
Saki’s X-ray inspection machine features a unique ultra-rigid gantry that results in a long equipment lifetime and high repeatability. Designed for the easy replacement of parts, maintenance is greatly improved, while Saki’s new detector offers significantly reduced component radiation thanks to its redeveloped lead protection design.

Self-diagnostic functions

Sustaining high-precision, high-accuracy inspection is important to maintain high productivity.
Saki’s X-ray inspection equipment regularly diagnoses the deterioration of the X-ray source, uneven image brightness, frame distortion, and more. Maintenance can be carried out in a planned manner and high-accuracy can be maintained.
Self-diagnosis prevents sudden equipment failure, reduces equipment downtime, prevents unnecessary replacement of non-defective parts, and reduces maintenance man-hours.

Time Based Maintenance

Condition Based Maintenance

X-ray Dosage Simulator

When performing X-ray inspections, many people are concerned about the risk of component failure due to radiation exposure.

Saki’s X-ray inspection equipment is equipped with an exposure dose simulator, predicting the exposure dose for each area to optimize imaging conditions. X-rays are irradiated only during imaging, minimizing irradiation.

X-ray dosage simulator

Specification

Specification

Model3Xi-M200​
Size
(W) x (D) x (H)mm (in.)
1400x2165x1862 (55.12 x 85.24 x 73.31 in)
Resolution51μm-104μm
PCB ClearanceTop : 68mm (2.68 in.)
Bottom : 40mm (1.57 in.)
Electric Power RequirementThree Phase ~200V +/-10%, 50/60Hz
X-ray Tube180kV 90W, Closed X-ray Tube
X-ray Leakage0.5μSv/h以下
PCB Size
(W) x (L) mm (in.)
50×140 – 460×440 (1.97 x 5.52 – 18.12 x 17.33 in.)    
50×140 – 460×600 (1.97 x 5.52 – 18.12 x 23.63 in.)*
Model3Xi-M200​
Size
(W) x (D) x (H)mm (in.)
1400x2165x1862
(55.12 x 85.24 x 73.31 in)
Resolution51μm-104μm
PCB ClearanceTop : 68mm (2.68 in.)
Bottom : 40mm (1.57 in.)
Electric
Power Requirement
Three Phase ~200V +/-10%, 50/60Hz
X-ray Tube180kV 90W, Closed X-ray Tube
X-ray Leakage0.5μSv/h以下
PCB Size
(W) x (L) mm (in.)
50×140 – 460×440 (1.97 x 5.52 – 18.12 x 17.33 in.)    
50×140 – 460×600 (1.97 x 5.52 – 18.12 x 23.63 in.)*

*Target board size with 2x imaging option

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