Watch the latest interviews and panel discussions with our thought leaders and technical experts sharing their thoughts and knowledge on the latest trends and developments in electronics manufacturing with a focus on automated inspection.


Filmed live at Productronica by Global SMT & Packaging, Jarda Neuhauser, our General Manager of Saki Europe introduces Saki’s compact, lightweight, Inline 3D-CT automated X-ray inspection (AXI) machine for printed circuit board assemblies. The 3Xi-M110 machine, which features new software that reduces cycle time by up to 50%, ensures the quality of hidden solder joints for bottom-electrode packages such as BGAs, LGAs, QFNs, flip-chip, and package-on-package and provides precise volumetric measurements and shape reconstruction to find voids, head-in-pillow, and other defects that are difficult to identify.


In a panel discussion hosted by Global SMT & Packaging and Moderator by Trevor Galbraith, Jarda Neuhauser joined industry colleagues from Saki, Koy Young, Mirtec and Viscom on the live Productronica forum stage for a lively debate titled “Camera, Lights, Action”. With SPI, AOI and X-ray systems as the eyes and ears on the production line, the panellists discussed how have they have improved in recent years and how critical these solutions are to a smart factory environment.


Next, the team at EPP invited Jarda Neuhauser to their studio at Productronica to explore market trends with a focus on the European region and find out about the latest innovations from Saki that were featured at the show, including the 3Di-LS2 with Z-axis optical-head control feature, 18μm resolution and side camera, the 3Di-LS2 with high resolution optical head, the 3Xi-M110 (3D-CT AXI), 3Si-LS2 (3D-SPI), 2Di-LU1 (2D-AOI) and the latest advancements in Saki’s Line Control Software Solutions.


In a German language interview it was an opportune time for our newest colleague Daniel Laue to introduce himself as Saki’s Sales Manager for the DACH region. Daniel joined Saki as Regional Sales Manager for Germany to offer technical sales for Saki’s full range of 3D solder paste inspection (SPI), automated optical inspection (AOI), and automated X-ray inspection (AXI) equipment and software solutions to German customers.
Driven by market growth and Saki’s strengthening position in the German-speaking region, the appointment of Daniel is part of Saki’s investment drive to expand its direct sales force and adding further technical sales expertise to complement the business development activities of Saki’s long standing distribution partner Selecs.



A scene from a panel discussion hosted by Global SMT & Packaging

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