3D-SPI Technology

Ultra high speed systems improve overall productivity of the line

Saki’s proprietary technology enables ultra -high-speed, high-precision measurement and inspection.

Provides improvement of both inspection capability and productivity

3D Solder Paste Inspection Machine (SPI)

01

Technology development background

Saki provides flexible and scaleable solutions to meet the needs of the industry. A broad range of applications is supported with multiple machine sizes, single and dual lane conveyor systems, and multiple sensor resolution levels of 7μm, 12μm, and 18μm.
By using common hardware and software for its SPI and AOI systems Saki reduces opertaor skill level requirements, spare parts investment and provides shorter lead-times.

02

Improved floorspace productivity with our M size platform

Saki's M size system width of 13" (330mm) maximizes your floorspace and productivity. The system is especially suitable for automotive and mobile, hand held products. The Si/Di Series has a reduced footprint of 25% compared to previous models.

3Si/3Di Series

3Si/3Di Series M-size System

Proprietary hardware

Saki's unique gantry design includes a dual Y Axis drive and dual servos with linear encoders to produce high precision, high repeatability, and high speed inspection. The system is designed to provide highly stable inspection in the most demanding production environments. Coupled with a rigid gantry structure Saki's unique design delivers 3μm (3σ) positional accuracy.

01

Industry-leading productivity

Our unique system uses a CoaXPress Standard 12 MP high speed camera to deliver industry leading 6,400 mm2/sec inspection speed at 18μm resolution. This system is 1.9 x faster than our previous model supporting the worlds most demanding applications including those with cycle times down to 13 seconds.

02

Enhanced utility and improved equipment capacity utilization ratios with the improved transfer system

An optional feature permits the operator to remove a defective PCB from within the machine. This feature eliminates the need, expense, and floorspace for an external conveyor. The conveyor system supports PCB's up to 25.5 lbs (12kg).

03

High-precision 0201 pad inspection

The high-resolution (7 μm) model supports high-precision 0201 pad inspection.

Paste solder imaging by 3Si (7 μm)

Proprietary software

Saki's system maps and saves an image of the entire PCB surface. This enables warpage compensation and provides historic 3D viewing supporting traceability requirements. The system can save a complete image of every PCB and all of its components for retrieval and viewing at a later date.

Unique substrate surface image

3D image of the entire substrate surface

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Saki Self-Programming (SSP) Software

Use of Gerber and Placement machine centroid data make it possible to output and manage data by component, and use the same data for both AOI and SPI systems using Saki's Self-Programming (SSP) Software.

02

Improved coplanarity inspection for high I/O count devices

Consistent solder paste height or coplanarity is critical for high I/O devices like BGA's to prevent open solder joints from occurring. Saki provides a unique 3D SPI algorithm designed for inspecting coplanarity to eliminate coplanarity.

Coplanarity image

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New SPC Funstionality

Saki's new process quality and traceability tools help you visualize solder paste deposition metrics.

04

Multi Process View (MPV)

Saki's Multi Process View feature displays the results of multiple processes, SPI, pre-reflow AOI, and post reflow AOI, on one screen in real time. The feature allows you to compare the component in various steps of the process to aid in process troubelshooting and root cause analysis.

Automatic Self-diagnostic System provides consistent performance, and predictive and preventive maintenance

To realize high productivity, with reliable and consistant results the Saki system includes a Self Diagnostic feature set. The system assures accuracy and reliability by providing real-time monitoring of critical assemblies, and visualization of machine operational status. The feature includes both predictive and preventive maintenance management. The system identifies degrading performance, prompts scheduled maintenence and replacement of consumable parts to eliminate down time due to unforeseen errors and failures.

Time Based Maintenance

Condition Based Maintenance

High productivity and high precision inspection are necessary requirements to support M2M (machine to machine) interaction and SMART factory implementation.
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