3D Automated Optical Inspection Systems

3D-AOI

3Di Series

Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.

Product list

Scroll from left to right

Dimensions M
Single Lane
M
Dual Lane
L
Single Lane
L
Dual Lane
XL
Single Lane
Model 3Di-MS2 3Di-MD2 3Di-LS2 3Di-LD2 3Di-ZS2
Size
(W) x (D) x (H) [Main body]mm (in.)
850 x 1430 x 1500
(33.46 x 56.30 x 59.06)
1040 x 1440 x 1500
(40.94 x 56.69 x 59.06)
1340 x 1440 x 1500
(52.75 x 56.69 x 59.06)
Weight Approx. 850 Kg, 1873.93 lbs Approx. 900 Kg, 1984.16 lbs
Electric Power Requirement Single-phase ~ 200-240V +/-10%, 50/60Hz
Resolution 7μm, 12μm, 18μm 18μm
Air Requirement 0.5MPa, 5L/min (ANR)
PCB Size
mm (in.)
- Single mode - Single mode -
50 W x 60 L - 330 W x 330 L
(1.97 Wx 2.36 L - 12.99 W x 12.99 L)
50 W x 60 L - 330 W x 330 L
( 1.97 W x 2.36L - 12.99 W x 12.99 L)
7µm camera head
50 W x 60 L - 330 W x 330 L
(1.97 W x 2.36 L - 12.99 W x 12.99 L)
7µm camera head
50 W x 60 L - 330 W x 330 L
(1.97 W x 2.36 L - 12.99 W x 12.99 L)
12/18 µm camera head
50 W x 60 L - 500 W x 510 L
(1.97 W x 2.36 L - 19.68 W x 20.07 L)
50 W x 60 L - 686 W x 870 L
(1.97 W x 2.36 L - 27.00 W x 34.25 L)
Dual mode - Dual mode
50 W x 60 L - 320 W x 330 L
( 1.97 W x 2.36L - 12.60 W x 12.99 L)
12/18 µm camera head
50 W x 60 L - 320 W x 330 L
(1.97 W x 2.36 L - 12.60 W x 12.99 L)
7µm camera head
50 W x 60 L - 320 W x 330 L
(1.97 W x 2.36 L - 12.60 W x 12.99 L)
12/18 µm camera head
50 W x 60 L - 320 W x 510 L
(1.97 W x 2.36 L - 12.60 W x 20.07 L)
PCB Clearance Top: 40mm, 1.57 in.
Bottom: 60mm, 2.36 in.
Top: 40mm, 1.57 in.
Bottom: 50mm, 1.96 in.
Top: 40mm, 1.57 in.
Bottom: 60mm, 2.36 in.
Top: 40mm, 1.57 in.
Bottom: 50mm, 1.96 in.
Top: 40mm, 1.57 in.
Bottom: 60mm, 2.36 in.

Feature

01 FEATURE

Hardware that provides
high-speed and
high-accuracy inspection

Rigid gantry structure and exclusive dual motor drive system

High resolution linear scale provides high accuracy positioning

CoaXPress camera delivers faster inspection and measurement processes

Automatic Self-diagnostic functionality monitors machine performance

02 FEATURE

Hardware : Flexible Configurations meet a broad range of applications

Multiple inspection resolutions of 7μm, 12μm, and 18μm

Multiple machine sizes include medium, large, extra large and dual lane

Side Cameras

Select from a variety of options including machine size, inspection resolution, hardware and software features to meet your specific requirements

03 FEATURE

Advanced
Software Features

Saki Self-Programming Software (SSP)

Inspection compliance with IPC 610 Standards

Extra Component Detection identifies foreign material

"Fujiyama"Through-hole Device Solder Inspection

Technology

Saki 3D inspection technology supports a broad range of applications.

3D-AOI Technology