Product list
3Xi Series
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Model | 3Xi-M110 | 3Xi-M200 |
---|---|---|
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Size (W) x (D) x (H) [Main body]mm (in.) |
1380 x 2150 x 1500 (54.34 x 84.65 x 59.06) |
1400 x 2580 x 1862 (55.12 x 101.58 x 73.31) |
Weight | Approx. 3100 Kg (6834.34 lbs) | Approx. 5100 Kg (11243.58 lbs) |
Electric Power Requirement | Three-phase 200V +/ 10%, 50/60Hz 4.2 kVA With Cable 5m | |
Resolution | 10μm-30μm | 25μm-80μm |
Tube | 110kV 30W, Closed X-ray Source | 200kV 30W, Open X-ray tube |
Xray leakage | 0.5μSv/h or less | |
Air Requirement | 0.5MPa @ ≥ 20L/min (ANR) | |
Target PCB Size mm (in.) |
50 W x 120 L - 360 W x 330 L
(1.97 W x 4.73 L - 14.17 W x 12.99 L) 50 W x 120 L - 360 W x 510 L ※ (1.97 W x 4.72 L - 14.17 W x 20.07 L)※ |
50 W x 140 L - 360 W x 330 L
(1.97 W x 5.52 L - 14.17 W x 12.99 L) 50 W x 140 L - 360 W x 510 L ※ (1.97 W x 5.52 L - 14.17 W x 20.07 L)※ |
PCB Clearance |
Top: 60 mm (2.36 in.) Bottom: 40 mm (1.57 in.) |
※with applying the two-step imaging option
BF-X Series
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Feature
01 FEATURE
Saki's unique "Planar CT" technology

Acquires high-quality CT images of planar objects using fewer projections
Identifies various defects in 3D images
02 FEATURE
Intuitive User-friendly
software

High accuracy true 3D automatic inspection
Displays actual measurement and target point with 3D images
Displays defects in high-precision 3D color images
03 FEATURE
Expands the range
of inspection

Inspection of standard PCBs, components and solder joints, and other electric components
Head in Pillow (HIP)
Detection and measurement of voids in multilayer PCB power modules.
the brochures download form
