Product list
3Xi Series
Scroll from left to right
| Model | 3Xi-M110 | 3Xi-M200 |
|---|---|---|
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| Size (W) x (D) x (H) [Main body] (mm, in.) |
1380 x 2150 x 1500 (54.34 x 84.65 x 59.06) |
1400 x 2580 x 1862 (55.12 x 101.58 x 73.31) |
| Weight | Approx. 3100 Kg (6834.34 lbs) | Approx. 5100 Kg (11243.58 lbs) |
| Electric Power Requirement | Three-phase 200V +/ 10%, 50/60Hz 4.2 kVA With Cable 5m | |
| Resolution | 10μm-30μm | 25μm-80μm |
| Tube | 110kV 30W, Closed X-ray Source | 200kV 30W, Open X-ray tube |
| Xray leakage | 0.5μSv/h or less | |
| Air Requirement | 0.5 MPa @ ≥ 20L/min (ANR) | 0.5 MPa @ ≥ 20L/min (ANR) |
| Target PCB Size (mm, in.) |
50 W x 120 L - 360 W x 330 L
(1.97 W x 4.73 L - 14.17 W x 12.99 L) |
50 W x 140 L - 360 W x 330 L
(1.97 W x 5.52 L - 14.17 W x 12.99 L) |
| PCB Clearance | Top: 60 mm (2.36 in.) Bottom: 40 mm (1.57 in.) |
Top: 60 mm (2.36 in.) Bottom: 40 mm (1.57 in.) |
BF-X Series
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| Model | BF-X2 | BF-X3 | |
|---|---|---|---|
|
130kV 200kV 
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| Dimensions (W) x (D) x (H) [Main body] (mm, in.) |
1820 x 2680 x 1880 (71.65 x 105.52 x 74.01) |
1836 x 2680 x 1880 (72.28 x 105.51 x 74.01) |
1820 x 2250 x 1880 (71.65 x 88.58 x 74.01) |
| Weight | Approx. 5500 Kg (12125.43 lbs) | Approx. 6500 Kg (14330.05 lbs) | Approx. 5200 Kg (11464.04 lbs) |
| Electric Power Requirement | Three phase four wire system 400V Y connection 400V+/ 10%, 50/60Hz 7 kVA Cable 5 m | ||
| Resolution | 9-29µm | 21-68μm | 13μm-30μm |
| Tube | 130kV or 200 kV 30 W Open X-ray tube | 130kV, 16W, Closed X-ray Source | |
| X-ray leakage | 0.5μSv/h or less | ||
| Air Requirement | 0.5 MPa @ ≥ 60L/min (ANR) | ||
| Target PCB Size (mm, in.) |
50 W x 120 L - 460 W x 510 L (1.97 x 4.72 - 18.11 x 20.08) |
50 W x 140 L - 460 W x 510 L (1.97 x 5.51 - 18.11 x 20.08) |
50 W x 120 L - 460 W x 510 L (1.97 x 4.72 - 18.11 x 20.08) |
| PCB Clearance | Top: 40 mm (1.57 in.) Bottom: 40 mm (1.57 in.) |
Top: 40 mm (1.57 in.) Bottom: 40 mm (1.57 in.) |
|
Feature
01 FEATURE
Saki's unique "Planar CT" technology
Acquires high-quality CT images of planar objects using fewer projections
Identifies various defects in 3D images
Enables inspection without any interference from the opposite side of the board.
02 FEATURE
Intuitive User-friendly
software
High accuracy true 3D automatic inspection
Displays actual measurement and target point with 3D images
Displays defects in high-precision 3D color images
The system displays 3D reconstruction, 3D inspection, and 3D image display for all captured images.
03 FEATURE
Expands the range
of inspection
Inspection of standard PCBs, components and solder joints, and other electric components
Head in Pillow (HIP)
Detection and measurement of voids in multilayer PCB power modules.
Inspection of PCBs as well as semiconductors and power modules.
