Product list
3Xi Series
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Model | 3Xi-M110 | 3Xi-M200 |
---|---|---|
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Size (W) x (D) x (H) [Main body]mm (in.) |
1380W x 2150D x 1500H mm (54.34W x 84.65D x 59.06H in) |
1400W x 2165D x 1862H mm (55.12W x 85.24D x 73.31H in) |
Weight | Approx. 3100 Kg (6834.34 lbs) | Approx. 5200Kg (11464.04 lbs) |
Electric Power Requirement | Three Phase ~200V +/-10%, 50/60Hz | |
Resolution | 10μm-30μm | 51μm-104μm |
Tube | 110kV 30W, Closed X-ray Source | 180kV 90W, Closed X-ray Tube |
Xray leakage | 0.5μSv/h or less | |
Air Requirement | 0.5MPa @ ≥ 20L/min (ANR) | |
Target PCB Size mm (in.) |
50 W x 120 L - 360 W x 330 L
(1.97 W x 4.73 L - 14.17 W x 12.99 L) 50 W x 120 L - 360 W x 510 L ※ (1.97 W x 4.72 L - 14.17 W x 20.07 L)※ |
50(W)x140(L) - 460(W) x 440(L) mm
(1.97 W x 5.52 L - 18.12 W x 17.33 L in.) 50(W)x140(L) - 460(W) x 600(L) mm ※ (1.97 W x 5.52 L - 18.12 W x 23.63 L in.) ※ |
Clearance | Top : 60mm (2.36 in.) Bottom : 40mm (1.57 in.) |
Top : 68mm (2.68 in.) Bottom : 40mm (1.57 in.) |
※2x imaging option target board size
Feature
01 FEATURE
Saki's unique "Planar CT" technology

Acquires high-quality CT images of planar objects using fewer projections
Identifies various defects in 3D images
02 FEATURE
Intuitive User-friendly
software

High accuracy true 3D automatic inspection
Displays actual measurement and target point with 3D images
Displays defects in high-precision 3D color images
03 FEATURE
Expands the range
of inspection

Inspection of standard PCBs, components and solder joints, and other electric components
Head in Pillow (HIP)
Detection and measurement of voids in multilayer PCB power modules.
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