Inline 3D-CT Automated X-ray Inspection Systems

3D-AXI

3Xi Series/BF-X Series

Saki's 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.

Product list

3Xi Series

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Model 3Xi-M110 3Xi-M200
Size
(W) x (D) x (H) [Main body]mm (in.)
1380 x 2150 x 1500
(54.34 x 84.65 x 59.06)
1400 x 2580 x 1862
(55.12 x 101.58 x 73.31)
Weight Approx. 3100 Kg (6834.34 lbs) Approx. 5100 Kg (11243.58 lbs)
Electric Power Requirement Three-phase 200V +/ 10%, 50/60Hz 4.2 kVA With Cable 5m
Resolution 10μm-30μm 25μm-80μm
Tube 110kV 30W, Closed X-ray Source 200kV 30W, Open X-ray tube
Xray leakage 0.5μSv/h or less
Air Requirement 0.5 MPa @ ≥ 20L/min (ANR) 0.5 MPa @ ≥ 20L/min (ANR)
Target PCB Size
mm (in.)
50 W x 120 L - 360 W x 330 L
(1.97 W x 4.73 L - 14.17 W x 12.99 L)
50 W x 140 L - 360 W x 330 L
(1.97 W x 5.52 L - 14.17 W x 12.99 L)
PCB Clearance Top: 60 mm (2.36 in.)
Bottom: 40 mm (1.57 in.)
Top: 60 mm (2.36 in.)
Bottom: 40 mm (1.57 in.)

BF-X Series

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Model BF-X2 BF-X3

130kV

200kV

 

 

Dimensions
(W) x (D) x (H) [Main body]mm (in.)
1820 x 2680 x 1880
(71.65 x 105.52 x 74.01)
1836 x 2680 x 1880
(72.28 x 105.51 x 74.01)
1820 x 2250 x 1880
(71.65 x 88.58 x 74.01)
Weight Approx. 5500 Kg (12125.43 lbs) Approx. 6500 Kg (14330.05 lbs) Approx. 5200 Kg (11464.04 lbs)
Electric Power Requirement Three phase four wire system 400V Y connection 400V+/ 10%, 50/60Hz 7 kVA Cable 5 m
Resolution 9-29µm 21-68μm 13μm-30μm
Tube 130kV or 200 kV 30 W Open X-ray tube 130kV, 16W, Closed X-ray Source
X-ray leakage 0.5μSv/h or less
Air Requirement 0.5 MPa @ ≥ 60L/min (ANR)
Target PCB Size
mm (in.)
50 W x 120 L - 460 W x 510 L
(1.97 x 4.72 - 18.11 x 20.08)
50 W x 140 L - 460 W x 510 L
(1.97 x 5.51 - 18.11 x 20.08)
50 W x 120 L - 460 W x 510 L
(1.97 x 4.72 - 18.11 x 20.08)
PCB Clearance Top: 40 mm (1.57 in.)
Bottom: 40 mm (1.57 in.)
Top: 40 mm (1.57 in.)
Bottom: 40 mm (1.57 in.)

Feature

01 FEATURE

Saki's unique "Planar CT" technology

Acquires high-quality CT images of planar objects using fewer projections

Identifies various defects in 3D images

Enables inspection without any interference from the opposite side of the board.

02 FEATURE

Intuitive User-friendly
software

High accuracy true 3D automatic inspection

Displays actual measurement and target point with 3D images

Displays defects in high-precision 3D color images

The system displays 3D reconstruction, 3D inspection, and 3D image display for all captured images.

03 FEATURE

Expands the range
of inspection

Inspection of standard PCBs, components and solder joints, and other electric components

Head in Pillow (HIP)

Detection and measurement of voids in multilayer PCB power modules.

Inspection of PCBs as well as semiconductors and power modules.

Technology

Saki's Automated X-ray Inspection (AXI) Technology

3D-AXI Technology