Product list
3Xi Series
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| Model | 3Xi-M110 | 3Xi-M200 |
|---|---|---|
 
Videos |
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| Size (W) x (D) x (H) [Main body]mm (in.) |
1380W x 2150D x 1500H mm (54.34W x 84.65D x 59.06H in) |
1400W x 2165D x 1862H mm (55.12W x 85.24D x 73.31H in) |
| Weight | Approx. 3100 Kg (6834.34 lbs) | Approx. 5200Kg (11464.04 lbs) |
| Electric Power Requirement | Three Phase ～200V +/-10%, 50/60Hz | |
| Resolution | 10μm-30μm | 51μm-104μm |
| Tube | 110kV 30W, Closed X-ray Source | 180kV 90W, Closed X-ray Tube |
| Xray leakage | 0.5μSv/h or less | |
| Air Requirement | 0.5MPa @ ≥ 20L/min (ANR) | |
| Target PCB Size mm (in.) |
50 W x 120 L - 360 W x 330 L
(1.97 W x 4.73 L - 14.17 W x 12.99 L) 50 W x 120 L - 360 W x 510 L ※ (1.97 W x 4.72 L - 14.17 W x 20.07 L)※ |
50(W)x140(L) - 460(W) x 440(L) mm
(1.97 W x 5.52 L - 18.12 W x 17.33 L in.) 50(W)x140(L) - 460(W) x 600(L) mm ※ (1.97 W x 5.52 L - 18.12 W x 23.63 L in.) ※ |
| Clearance | Top : 60mm (2.36 in.) Bottom : 40mm (1.57 in.) |
Top : 75mm (2.96 in.) Bottom : 40mm (1.57 in.) |
※2x imaging option target board size
Feature
01 FEATURE
Saki's unique "Planar CT" technology
Acquires high-quality CT images of planar objects using fewer projections
Identifies various defects in 3D images
Enables inspection without any interference from the opposite side of the board.
02 FEATURE
Intuitive User-friendly
software
High accuracy true 3D automatic inspection
Displays actual measurement and target point with 3D images
Displays defects in high-precision 3D color images
The system displays 3D reconstruction, 3D inspection, and 3D image display for all captured images.
03 FEATURE
Expands the range
of inspection
Inspection of standard PCBs, components and solder joints, and other electric components
Head in Pillow (HIP)
Detection and measurement of voids in multilayer PCB power modules.
Inspection of PCBs as well as semiconductors and power modules.
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