Inline 3D-CT Automated X-ray Inspection Systems

3D-AXI

3Xi Series

3Xi-M110 for PCBAs

Saki's high-resolution "Planar CT" technology, uniquely engineered for "Real 3D” Volumetric Inspection, discovers assembly defects that cannot be seen using external inspections alone.
The system contributes to quality improvements by accurately pinpointing diverse types of soldering and component defects.

Features

Performs highly accurate volumetric inspection on PCBAs using "Real 3D" information

Lightweight 40%↓ Small footprint 25%↓

Rigid, highly stable chassis and compact footprint.
For maximum effectiveness in the production line.

NEW

Cycle Time 50%↓

Saki’s 3Xi-M110 has halved the cycle time, thanks to a new software X-ray imaging mode and optimized control and motor speed.

Reduced x-ray exposure 70%↓

The new X-ray tube powers-on the emitter only during image capture, reducing X-ray exposure by up to 70%.

Various inspection functions

Highly accurate volumetric inspection using
"Real 3D" image data

[

BGA Head-in-pillow (HiP)

]

Able to distinguish shapes of non-wetting faults such as BGA head-in-pillow, which are difficult to detect. Capable of analyzing both void volume ratio and void area ratio.

[

THT
(Through-hole-technology)

]

By measuring the solder quantity in through-holes (filling rate), the system reliably discovers defects in THT assemblies that that standard tomography inspection systems would overlook.

[

Chip components

]

Determines whether a chip component is good or bad based on changes in fillet position, height, width, angle, solder quantity. Visualizes the fillet shape of non-wet chips.

[

IC components

]

Capable of judging whether an IC component is good or bad based on changes in fillet position, height, width, angle, solder quantity. Detects bridge defects when solder crosses between leads. Visualizes the fillet shape of a non-wet lead.

3Xi-M110 Promotion Video

NEW

3Xi-M110 3DCG Video

Click here for
the brochures download form
Products TOP Page