Inline 3D-CT Automated X-ray Inspection Systems

3D-AXI

3Xi Series

3Xi-M110

Saki's high-resolution "Planar CT" technology, uniquely engineered for "Real 3D” Volumetric Inspection, discovers assembly defects that cannot be seen using external inspections alone.
The system contributes to quality improvements by accurately pinpointing diverse types of soldering and component defects.

Features

Performs highly accurate volumetric inspection on PCBAs using "Real 3D" information

軽量化40%↓ 小型化25%↓

Rigid, highly stable chassis and compact footprint.
For maximum effectiveness in the production line.

高速化30%↑

Optimized Planar Computed Tomography (PCT) technology algorithm improves image capture speed by 30%, reducing takt time.

低被曝70%↓

The new X-ray tube powers-on the emitter only during image capture, reducing X-ray exposure by up to 70%.

Various inspection functions

Highly accurate volumetric inspection using
"Real 3D" image data

[

BGA Head-in-pillow (HiP)

]

Able to distinguish shapes of non-wetting faults such as BGA head-in-pillow, which are difficult to detect. Capable of analyzing both void volume ratio and void area ratio.

[

THT
(Through-hole-technology)

]

By measuring the solder quantity in through-holes (filling rate), the system reliably discovers defects in THT assemblies that that standard tomography inspection systems would overlook.

[

Chip components

]

Determines whether a chip component is good or bad based on changes in fillet position, height, width, angle, solder quantity. Visualizes the fillet shape of non-wet chips.

[

IC components

]

Capable of judging whether an IC component is good or bad based on changes in fillet position, height, width, angle, solder quantity. Detects bridge defects when solder crosses between leads. Visualizes the fillet shape of a non-wet lead.

3Xi-M110 Promotion Video

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3Xi-M110 3D-CG Video

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