Performs highly accurate volumetric inspection on PCBAs using "Real 3D" information
Rigid, highly stable chassis and compact footprint.
For maximum effectiveness in the production line.
Saki’s 3Xi-M110 has halved the cycle time, thanks to a new software X-ray imaging mode and optimized control and motor speed.
The new X-ray tube powers-on the emitter only during image capture, reducing X-ray exposure by up to 70%.
Various inspection functions
Highly accurate volumetric inspection using
"Real 3D" image data
BGA Head-in-pillow (HiP)
Able to distinguish shapes of non-wetting faults such as BGA head-in-pillow, which are difficult to detect. Capable of analyzing both void volume ratio and void area ratio.
By measuring the solder quantity in through-holes (filling rate), the system reliably discovers defects in THT assemblies that that standard tomography inspection systems would overlook.
Determines whether a chip component is good or bad based on changes in fillet position, height, width, angle, solder quantity. Visualizes the fillet shape of non-wet chips.
Capable of judging whether an IC component is good or bad based on changes in fillet position, height, width, angle, solder quantity. Detects bridge defects when solder crosses between leads. Visualizes the fillet shape of a non-wet lead.
3Xi-M110 Promotion Video
3Xi-M110 3DCG Video
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