Features
High-precision inspection inside multi-layer IGBT modules using "Real 3D" image data
Rigid, highly stable chassis and compact footprint.
For maximum effectiveness in the production line.
Optimized Planar Computed Tomography (PCT) algorithm improves image capture speeds by 30%, reducing takt time.
Various inspection functions
Dectect and assess voids accurately using Saki's high-resolution "Planar CT" technology
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Planar CT image
]
X-ray transmission image
Planar CT image
DBC solder layer
Planar CT image
Chip solder layer
Clearer inspection of voids by processing image to remove shadows of external cooling fins.
Automatic measurement and image correction of part warpage ensures high-precision inspection.
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Advanced Software
Features
]
Without statistical filter
With statistical filter
Advanced image-processing software removes images of DBC traces that interfere with inspection,
enabling more accurate measurement of voids.
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