3D Solder Paste Inspection Machine

3D-SPI

3Si Series

Saki's 3D SPI identifies critical defects and assists with process improvement.

Product list

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Dimensions M
Single Lane
M
Dual Lane
L
Single Lane
L
Dual Lane
XL
Single Lane
Model 3Si-MS2 3Si-MD2 3Si-LS2 3Si-LD2 3Si-ZS2
Size
(W) x (D) x (H) [Main body]mm (in.)
850 x 1430 x 1500
(33.46 x 56.30 x 59.06)
1040 x 1440 x 1500
(40.94 x 56.69 x 59.06)
1340 x 1440 x 1500
(52.75 x 56.69 x 59.06)
Weight Approx. 850 Kg, 1873.93 lbs Approx. 900 Kg, 1984.16 lbs
Electric Power Requirement Single-phase ~ 200-240V +/-10%, 50/60Hz
Resolution 7μm, 12μm, 18μm 18μm
Air Requirement 0.5MPa, 5L/min (ANR)
PCB Size
mm (in.)
- Single mode - Single mode -
50 W x 60 L - 330 W x 330 L
(1.97 Wx 2.36 L - 12.99 W x 12.99 L)
50 W x 60 L - 330 W x 330 L
( 1.97 W x 2.36L - 12.99 W x 12.99 L)
7µm camera head
50 W x 60 L - 330 W x 330 L
(1.97 W x 2.36 L - 12.99 W x 12.99 L)
7µm camera head
50 W x 60 L - 330 W x 330 L
(1.97 W x 2.36 L - 12.99 W x 12.99 L)
12/18 µm camera head
50 W x 60 L - 500 W x 510 L
(1.97 W x 2.36 L - 19.68 W x 20.07 L)
50 W x 60 L - 686 W x 870 L
(1.97 W x 2.36 L - 27.00 W x 34.25 L)
Dual mode - Dual mode
50 W x 60 L - 320 W x 330 L
( 1.97 W x 2.36L - 12.60 W x 12.99 L)
12/18 µm camera head
50 W x 60 L - 500 W x 510 L
(1.97 W x 2.36L - 19.68 W x 20.07 L)
7µm camera head
50 W x 60 L - 320 W x 330 L
(1.97 W x 2.36 L - 12.60 W x 12.99 L)
12/18 µm camera head
50 W x 60 L - 320 W x 510 L
(1.97 W x 2.36 L - 12.60 W x 20.07 L)
PCB Clearance Top: 40mm, 1.57 in.
Bottom: 60mm, 2.36 in.
Top: 40mm, 1.57 in.
Bottom: 50mm, 1.96 in.
Top: 40mm, 1.57 in.
Bottom: 60mm, 2.36 in.
Top: 40mm, 1.57 in.
Bottom: 50mm, 1.96 in.
Top: 40mm, 1.57 in.
Bottom: 60mm, 2.36 in.

Feature

01 FEATURE

Hardware: Providing high-speed and high-accurate inspection

Shares the same rigid gantry structure with Saki's 3Di-AOI

Rigid gantry structure and exclusive dual Y axis motor drive system

High resolution linear scale for accurate positioning

CoaXPress camera delivers higher speed and higher accuracy measurement

Automatic Self-diagnostic functionality monitors machine performance

02 FEATURE

Hardware: Flexible Configurations for Wide Ranging Applications

Simultaneous 2D and 3D inspection of the entire PCB surface

Three sensors are available with 7μm, 12μm, and 18μm resolution

Three machine sizes available including dual lane to support varying applications

Select from a variety of options including machine size, inspection resolution, hardware and software features to meet your specific requirements

03 FEATURE

Software: Advanced features

Warpage management

Coplanarity inspection

SPC Function

Technology

Saki SPI identifies critical defects increasing yield and eliminating re re-work.

3D-SPI Technology