3D Solder Paste Inspection Machine

3D-SPI

3Si Series

3Si-LS2 / 3Si-LD2

Saki's Large machine supports PCB sizes up to 500 W x 510 L mm , 19.68" W x 20.07" L in. The system is offered with your choice of three resolutions 7, 12 and 18 micron. Many design characteristcis are shared between our L size AOI and SPI systems including the frame, gantry, PC, GUI and others. This commonality minimizes spare parts inventory and requires less training.

Feature

Hardware providing high-speed and high-accurate inspection

Shares the same rigid gantry structure with Saki's 3Di-AOI

Rigid gantry structure and exclusive dual Y axis motor drive system

High resolution linear scale for accurate positioning

CoaXPress camera delivers higher speed and higher accuracy measurement

Automatic Self-diagnostic functionality monitors machine performance

Hardware : Flexible Configurations for Wide Ranging Applications

Simultaneous 2D and 3D inspection of the entire PCB surface

Three sensors are available with 7μm, 12μm, and 18μm resolution

Three machine sizes available including dual lane to support varying applications

Select from a variety of options including machine size, inspection resolution, hardware and software features to meet your specific requirements

Advanced Software Features

Warpage management

Coplanarity inspection

SPC Function

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