3D Automated Optical Inspection Systems


3Di Series

3Di-LS2 / 3Di-LD2

Saki's new L size machine supports PCB sizes up to 500 W x 510 L mm, 19.7" W x 20.07" L in. The system is offered in three resolutions 7, 12 and 18 μm. Many design characteristcis are shared between our L size AOI and SPI systems including the frame, gantry, PC, GUI and others. This commonality minimizes spare parts inventory and requires less training.


Hardware that provides high-speed and high-accuracy inspection

Rigid gantry structure and exclusive dual motor drive system

High resolution linear scale provides high accuracy positioning

CoaXPress camera delivers faster inspection and measurement processes

Automatic Self-diagnostic functionality monitors machine performance

Hardware : Flexible Configurations meet a broad range of applications

Multiple inspection resolutions of 7μm, 12μm, and 18μm

Multiple machines sizes include medium, large and extra large, and dual lane

Side Cameras

Select from a variety of options including machine size, inspection resolution, hardware and software features to meet your specific requirements

Advanced Software Features

Saki Self-Programming Software (SSP)

Inspection compliance with IPC 610 Standards

Extra Component Detection identifies foreign material

"Fujiyama"Through-hole Device Solder Inspection

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