3D Automated Optical Inspection
Systems
3D-AOI
Fully compatible with both SMT and through-hole processes, the 3D-AOI meets all quality requirements for complex inspection targets, such as high-density printed circuit boards and boards housing a mix of both extremely small and tall components. The camera resolution and lighting are customizable to provide the flexibility to suit any production environment or product range.
01
High-Resolution
- Quality high-definition images clearly depict the smallest components
- Achieves total inspection – from extremely small-sized parts to the tallest components
High-definition images presenting minute parts and high-density PCBs in stunning clarity
Able to accurately inspect a range of parts with extremely clear imagery, the 3D-AOI inspects 0402mm and 0201mm components, as well as detailing narrow pitch IC and narrow pad parts.
New AOI
0402mm component captured on 3Di-LS3 / 8µm
Conventional AOI
Achieving the impossible – high-resolution imagery with an expanded height measurement range
The 3D-AOI maintains high resolution while expanding the height measurement range, achieving comprehensive inspection of both extremely small-sized and tall components. The height measurement range is up to 25mm with the resolution 8µm / 15µm camera alone, and can be expanded to 40mm when combined with the Z-axis option.
Tall Components with SMT Process
Press Fit Components
02
Fastest in the Industry
- Performs inspections at the quickest speed possible
- Stress-free, high-speed image data processing
Unparalleled AOI cycle times with both 8µm and 15µm resolution cameras
Enjoy speeds of 4,500mm²/sec with the 8µm camera and 7,000mm²/sec with the 15µm camera.
With the ability to handle components as small as 0402mm, the 15µm camera is ideal for high-volume products and those where speed is essential.
High-speed image data processing
Imaging, image data processing, and inspection are all performed in parallel – resulting in near-zero wait times.
Hardware operation and image processing are fully optimized thanks to the in-house development of customized software.
03
Scalability
- Multiple options available, including: dome lighting, side camera, Z-axis
- Camera resolution can be switched on-site
Upgradeable options enable a variety of board inspections with a single inspection machine
Upgrades enable continuous up-to-date performance and a wider range of inspection use from a sole unit.
Dome Lighting
Side Cameras
Z-Axis
On-site switching of camera resolution
Both resolution and speed can be switched according to the inspection target and production requirements.
Changeover can be completed in less than 90 minutes – including on-site calibration.
Optimal Functions for Each Process
SMT
- M2M co-operation with pick-and-place machine
- Saki’s Total Lineup Solution
Backend
- Insertion Inspection Solution
- Back-side solder inspection solution
M2M Co-Operation with Pick-and-Place Machine
Saki AOI machines are developed for M2M communication with all major surface mount machine manufacturers.
The AOI provides feedback to the surface mount machine regarding the mounting position, greatly strengthening quality assurance.
Saki’s Total Lineup Solution
Saki’s 3D-AOI uses a common platform with 3D-SPI and 3D-CT-AXI.
The process is consistent throughout – from post-printing solder inspection using SPI, through to the inspection of mounted components.
Insertion Inspection Solution
Saki provides a wide range of inspection solutions suitable for tall inserted components, such as character and polarity inspection of tall parts, and simultaneous measurement of the solder on the board and the height of tall parts. (With Z-axis option)
Back-Side Solder Inspection Solution
The 3D-AOI automates solder inspection, supporting flow, dip, and selective soldering.
Automation guarantees a more consistent quality than visual inspection, improving the solder inspection process and saving on labor.
THT solder inspection algorithm
Using 3D information, one algorithm covers all the necessary inspection items such as pin height, solder fillet height, and bridge inspection.
Extra Component Detection (ECD) doesn’t miss any fallen objects or surplus parts
By generating statistical sample data from approximately ten defect-free images, defects such as unexpected surplus parts, solder balls, and dust in the board can be automatically detected. Even without prepared samples, defects such as solder balls can be detected using design data and threshold information.
ECD NG Images
Specifications
| Dimensions | M | L | XL |
|---|---|---|---|
| Model | 3Di-MS3 | 3Di-LS3 | 3Di-ZS3 |
| Size[Main body] (W) x (D) x (H) mm (in.) | 850×1430×1500 (33.46 x 56.30 x 59.06) | 1040×1440×1500 (40.94 x 56.69 x 59.06) | 1340×1440×1500 (52.75 x 56.69 x 59.06) |
| Resolution | 8μm、15μm | ||
| PCB Clearance mm (in.) | Top: 40 (1.57) Bottom: 60 (2.36) *1 | ||
| Electric Power Requirement | Single-phase ~ 200-240V+/-10%, 50/60Hz | ||
| PCB Size （W）×（L）mm (in.) | 50 x 60 – 330 x 330 (1.97 x 2.36 – 12.99 x 12.99 )*2 | 50 x 60 – 500 x 510 (1.97 x 2.36 – 19.68 x 20.07)*3 | 50 x 60 – 686 x 870 (1.97 x 2.36 – 27.00 x 34.25) |
| Dimensions | M |
|---|---|
| Model | 3Di-MS3 |
| Size[Main body] (W) x (D) x (H) mm (in.) | 850×1430×1500 (33.46 x 56.30 x 59.06) |
| Resolution | 8μm、15μm |
| PCB Clearance mm (in.) | Top: 40 (1.57) Bottom: 60 (2.36) *1 |
| Electric Power Requirement | Single-phase ~ 200-240V+/-10%, 50/60Hz |
| PCB Size （W）×（L）mm (in.) | 50 x 60 – 330 x 330 (1.97 x 2.36 – 12.99 x 12.99 )*2 |
| Dimensions | L |
|---|---|
| Model | 3Di-LS3 |
| Size[Main body] (W) x (D) x (H) mm (in.) | 1040×1440×1500 (40.94 x 56.69 x 59.06) |
| Resolution | 8μm、15μm |
| PCB Clearance mm (in.) | Top: 40 (1.57) Bottom: 60 (2.36) *1 |
| Electric Power Requirement | Single-phase ~ 200-240V+/-10%, 50/60Hz |
| PCB Size （W）×（L）mm (in.) | 50 x 60 – 500 x 510 (1.97 x 2.36 – 19.68 x 20.07)*3 |
| Dimensions | XL |
|---|---|
| Model | 3Di-ZS3 |
| Size[Main body] (W) x (D) x (H) mm (in.) | 1340×1440×1500 (52.75 x 56.69 x 59.06) |
| Resolution | 8μm、15μm |
| PCB Clearance mm (in.) | Top: 40 (1.57) Bottom: 60 (2.36) *1 |
| Electric Power Requirement | Single-phase ~ 200-240V+/-10%, 50/60Hz |
| PCB Size （W）×（L）mm (in.) | 50 x 60 – 686 x 870 (1.97 x 2.36 – 27.00 x 34.25) |
*1 For dual mode, the PCB Clearance Bottom is 50mm (1.96 in.),
*2 For dual mode, the PCB Size is 50×60〜320×330 (1.97 x 2.36 – 12.60 x 12.99)
*3 For dual mode, the PCB Size is 50×60〜320×510 (1.97 x 2.36 – 12.60 x 20.07)
Use Case
TQ-Group
TQ-Group, a major German electronics solution provider, has installed Saki’s 3D-AOI and 3D-SPI to deliver even higher quality products.
Rohde & Schwarz
Rohde & Schwarz, a major German electronics solution provider, has installed Saki’s 3D-AOI and 3D-SPI to strengthen its manufacturing operations and deliver even higher quality products.
Smart Modular Technologies
Smart Modular Technologies, manufacturer of high-performance DRAM modules and solid-state disk drives (SSDs), has installed Saki’s 3D-AOI and 3D-SPI to handle miniaturization challenges and prepare for smart manufacturing.
Related Solutions
3D-SPI
3D Solder Paste
Inspection Machine
3D-CT AXI
Inline 3D-CT Automated
X-ray Inspection Systems
2D-AOI
2D Automated Optical Inspection Systems
3D-AOI