Leveraging technological innovations developed in-house,
our 3D AOI machine realizes both high resolution and high speed
To handle today’s rapidly changing market trends, the system can handle complex inspection challenges such as high component mounting density areas containing highly miniaturized parts placed near much larger and taller component.
With our new 3D AOI system, you can strengthen quality assurance and increase production efficiency.
Feature
01
High-resolution camera system for high-density boards and extremely small components
The newly developed high-resolution camera system ensures a sharply focused image and provides enhanced inspection resolution for tiny components such 0402mm or 0201mm SMD chips, fine-pitch ICs and closely located pads.
02
Delivering both high resolution and increased height-measurement capability
Despite its high resolution, the height-measurement range extends up to 25mm, enabling 3D inspection of all types of SMT-mounted parts including extremely small and tall components.
Tall component in SMT process
Combined with the Z-axis option, the height measurement range can be expanded up to 40mm.
Z-axis Option
03
Achieves the industry's fastest cycle time for AOI with 8μm camera resolution
Saki's team of optical-inspection experts handles all software development in-house. This ensures optimal interactions and coordination with the various hardware subsystems, achieving the industry's fastest cycle time. Image capture, processing and inspection algorithms are executed in parallel, minimizing waiting times.
*Total time of capturing and inspection with Saki's sample board in A5 size (150mm x 214mm).
*The inspection time may vary depending on the inspection condition.
04
High-resolution 3D Soldering inspection
Saki's unique soldering inspection algorithm improves pass/fail inspection accuracy by assessing both soldering fillet shape and wetting height.
Chip component
High-resolution images from the new camera system and enhanced color visibility of solder surface thanks to the advanced dome lighting* greatly enhance support for operator judgement.
*Dome lighting will be released after October 2022.
Dome lighting option
05
Customization of the features and great flexibility
Saki's new 3D AOI series delivers greater flexibility with the option to upgrade the camera system and customize the optical resolution and lighting according to specific production needs or the manufacturing environment. Customers can apply both hardware and software upgrades themselves to improve machine inspection capabilities, with minimal expertise needed and without significant downtime.
Product list
Scroll from left to right
| Dimensions | M Single Lane |
M Dual Lane |
L Single Lane |
L Dual Lane |
XL Single Lane |
|
|---|---|---|---|---|---|---|
| Model | 3Di-MS3 | 3Di-MD3 | 3Di-LS3 | 3Di-LD3 | 3Di-ZS3 | |
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| Size (W) x (D) x (H) [Main body]mm (in.) |
850×1430×1500 (33.46 x 56.30 x 59.06) |
1040×1440×1500 (40.94 x 56.69 x 59.06) |
1340×1440×1500 (52.75 x 56.69 x 59.06) |
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| Weight | Approx. 850 Kg, 1873.93 lbs | Approx. 900 Kg, 1984.16 lbs | ||||
| Electric Power Requirement | Single-phase ~ 200-240V+/-10%, 50/60Hz | |||||
| Resolution | 8μm | |||||
| Air Requirement | 0.5MPa, 5L/min（ANR） | |||||
| PCB Size mm (in.) |
- | Single mode | - | Single mode | - | |
| 50 W x 60 L - 330 W x 330 L (1.97 W x 2.36L - 12.99 W x 12.99 L) |
50 W x 60 L - 330 W x 330 L (1.97 W x 2.36L - 12.99 W x 12.99 L) |
50 W x 60 L - 500 W x 510 L (1.97 W x 2.36 L - 19.68 W x 20.07 L) |
50 W x 60 L - 500 W x 510 L (1.97 W x 2.36 L - 19.68 W x 20.07 L) |
50 W x 60 L - 686 W x 870 L (1.97 W x 2.36 L - 27.00 W x 34.25 L) |
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| Dual mode | Dual mode | |||||
| 50 W x 60 L - 320 W x 330 L (1.97 W x 2.36L - 12.60 W x 12.99 L) |
50 W x 60 L - 320 W x 510 L (1.97 W x 2.36 L - 12.60 W x 20.07 L) |
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| PCB Clearance | Top: 40mm, 1.57 in. Bottom: 60mm, 2.36 in. |
Top: 40mm, 1.57 in. Bottom: 50mm, 1.96 in. |
Top: 40mm, 1.57 in. Bottom: 60mm, 2.36 in. |
Top: 40mm, 1.57 in. Bottom: 50mm, 1.96 in. |
Top: 40mm, 1.57 in. Bottom: 60mm, 2.36 in. |
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