Next-
Generation 
AXI

Accurate Defect Detection with High-Resolution 3D Imaging

Advanced 3D CT technology enables highly accurate detection of defects such as BGA voids and non-wetting.
Press-fit components commonly used in large server PCBs are captured clearly in 3D, ensuring reliable detection of bent or missing pins.

Example of Defect Detection Using High-Definition Image Aquisition

Proprietary “Planar CT” Technology

SAKI’s unique planar CT technology rapidly captures hundreds of high-resolution tomographic images.
These are reconstructed into highly accurate 3D data, providing clear visualization of complex structures and even microscopic defects.

High-precision Correction Technology

Generating high-definition 3D imagery requires high-precision correction technology. SAKI’s 3D-AXI utilizes pattern data, an automatic board warp correction function in the XYZ directions, and a positioning function to help improve inspection accuracy while simplifying inspection program creation.

Even with large format PCBs, where warpage can significantly impact results, the system automatically identifies reference patterns and performs precise corrections.
This helps maintain stable and repeatable inspection performance even on warped large-format PCBs.

AI-Powered Inspection for Better Quality and Efficiency

AI Denoise

AI-driven noise reduction enhances image clarity, helping improve the detection of small voids and other subtle defects and dramatically improving inspection performance.

AI Inspect Void

Eliminates the need for manual parameter adjustment in void detection.
The algorithm automatically applies optimized inspection conditions to help maintain consistent inspection performance despite variations in imaging conditions.

Compact Design with Large Board Capability

Despite its compact footprint, the system supports PCB sizes up to 1000 x 690 mm (XXL).
It is ideal for space-constrained production environments and capable of handling today’s increasingly large and complex server boards.

Increased Throughput with High Inspection Performance

Compared to previous models, takt time is improved by approximately 1.6 times.
The optimized system design delivers faster inspection while maintaining high accuracy, helping improve throughput in high-volume production environments.

Robust Hardware Architecture

SAKI’s proprietary hardware design achieves both speed and precision:
・High-rigidity frame construction for durability and repeatability
・Dual-axis gantry system for stable motion
・Fully enclosed motor drive for precise positioning at high speeds

Flexible Clearance for Complex Assemblies

Designed with ample clearance to accommodate double-sided PCBs and tall components.
This flexibility supports the inspection of diverse board designs and assembly configurations.

Airless Design for Faster Startup Time

The airless shutter system enables faster operation and eliminates the need for air adjustments.
Benefits include:
・Reduced startup time
・Improved takt time
・Lower energy consumption and reduced CO₂ emissions

Easy Programming

Inspection program creation is significantly simplified:
・Use of design data
・Automatic imaging condition settings per FOV
This reduces setup time and improves operational efficiency.

Debugging Without Stopping the Production Line

The offline debugging function enables the collection and debugging of images without the need to stop the machine operations. Alongside real-time library updates, a catalogue of historic defect data is saved and can be re-inspected, supporting continuous process improvement and quality assurance.

Advantages of cooperation with AOI

For ease of operability, SAKI’s 3D-AXI inspection machine runs on the same software platform as its AOI solutions. By ensuring consistent quality control across the production line, inspection results from both AOI and AXI are integrated and displayed on the same screen.

X-ray Dosage Simulator

When performing X-ray inspections, managing radiation exposure is an important consideration for electronic assemblies. SAKI’s X-ray inspection equipment is equipped with an exposure dose simulator, predicting the exposure dose for each area to optimize imaging conditions. X-rays are generated only during image acquisition, minimizing exposure.